The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Jun. 09, 2014
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Yukiko Oshima, Anan, JP;

Yoshiki Sato, Anan, JP;

Toshiyuki Okazaki, Tokushima, JP;

Takayoshi Wakaki, Anan, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/644 (2013.01); H01L 33/486 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A light emitting device has a light emitting element, a package, a lead, and a cover film. The package is arranged to form at least part of an inner peripheral face of a recess portion. The light emitting element is housed in the recess portion. The lead is disposed on a bottom face of the recess portion. The lead is electrically connected to the light emitting element. The cover film is arranged to cover the inner peripheral face of the recess portion. The cover film has light transmissive and electrical insulation. The package includes a base material and a plurality of particles. The base material includes a resin. A coefficient of thermal expansion of the particles is different from a coefficient of thermal expansion of the base material. The particles are disposed at least near the inner peripheral face of the recess portion.


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