The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Mar. 28, 2016
Applicants:

Kmw U.s.a., Inc., Fullerton, CA (US);

SK Telesys Co., Ltd., Seongnam, KR;

Inventors:

Joon Hyong Shim, Yongin, KR;

Jong Ho Park, Yongin, KR;

Dae Ho Woo, Incheon, KR;

Dae Kwang Kim, Yongin, KR;

Myoung Yong Shin, Seongnam, KR;

Young Ho Jeon, Seongnam, KR;

Bung Chul Kim, Glendale, CA (US);

Nak Zu E, Fullerton, CA (US);

Bo Yong Bae, Irvine, CA (US);

Daniel Taeyoon Kim, Cypress, CA (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 40/00 (2009.01); H01L 33/06 (2010.01); H01L 33/08 (2010.01); H01L 33/00 (2010.01); H01L 33/18 (2010.01); H01L 33/24 (2010.01); H01L 33/36 (2010.01); H01L 33/44 (2010.01); H01L 33/40 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/06 (2013.01); H01L 33/005 (2013.01); H01L 33/007 (2013.01); H01L 33/0075 (2013.01); H01L 33/08 (2013.01); H01L 33/18 (2013.01); H01L 33/24 (2013.01); H01L 33/36 (2013.01); H01L 33/40 (2013.01); H01L 33/44 (2013.01); H01L 33/0095 (2013.01); H01L 33/382 (2013.01); H01L 33/387 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01);
Abstract

An apparatus for implementing an adaptive sectorization in a DAS (Distributed Antenna System) is provided. In some embodiment of the present disclosure, a DAS that supports an adaptive sectorization has the flexibility of supporting multiple sectors simply with an extension of STM (Sectorization Module) without being affected by the hardware structure. Where no sector splitting is needed, the STM is replaced by a COM (Head-end Combining Module) to provide a simple structure for supporting the sectors.


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