The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Dec. 02, 2015
Applicant:

Suzhou Qing Xin Fang Electronics Technology Co., Ltd., Suzhou, CN;

Inventor:

Jerry Zhijun Zhai, Toronto, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 49/02 (2006.01); H03H 7/075 (2006.01); H01F 17/04 (2006.01); H03H 7/09 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H03H 7/075 (2013.01); H01F 17/04 (2013.01); H01L 2924/0002 (2013.01); H03H 7/09 (2013.01); H03H 2001/0014 (2013.01); H03H 2001/0085 (2013.01); H03H 2001/0092 (2013.01);
Abstract

Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic circuits for use in systems and devices such as smartphones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, servers, networking equipment, industrial equipment, etc. Fabrications of such integrated laminate structures can be modularized into four (4) types of laminates, namely, inductive laminates, capacitive laminates, electromagnetic shielding laminates, and semiconductor chip laminates, which can be vertically laminated together and/or integrated side-by-side with high density to produce the desired electronic circuits, systems, and devices.


Find Patent Forward Citations

Zhai, Jerry. (2018). Laminates of integrated electromagnetically shieldable thin inductors, capacitors, and semiconductor chips (U.S. Patent No. 9871004). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9871004

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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