The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Nov. 29, 2016
Dai Nippon Printing Co., Ltd., Tokyo-to, JP;
Satoshi Shibasaki, Hasuda, JP;
Koji Tomita, Kawagoe, JP;
Masaki Yazaki, Fujimino, JP;
Kazuyuki Miyano, Sayama, JP;
Atsushi Kurahashi, Tsurugashima, JP;
Kazuhito Uchiumi, Kawagoe, JP;
Masachika Masuda, Tokorozawa, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.