The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Oct. 14, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Inventor:
Young-Deuk Kim, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/42 (2006.01); H01L 23/544 (2006.01); H01L 23/36 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/36 (2013.01); H01L 23/544 (2013.01); H01L 23/3135 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01);
Abstract
A semiconductor device includes a semiconductor package and a mark. The semiconductor package includes a semiconductor chip including a hot spot from which heat is generated, and a mold layer encapsulating the semiconductor chip. The mark is disposed on the semiconductor package. The mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot.