The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Mar. 28, 2014
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Eiichi Ide, Tokyo, JP;

Hiroshi Shintani, Tokyo, JP;

Hisashi Tanie, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 25/00 (2006.01); H01L 23/051 (2006.01); H01L 23/528 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 23/051 (2013.01); H01L 23/367 (2013.01); H01L 23/3672 (2013.01); H01L 23/3735 (2013.01); H01L 23/40 (2013.01); H01L 23/528 (2013.01); H01L 23/562 (2013.01); H01L 24/33 (2013.01); H01L 25/00 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A power conversion apparatus includes: a circuit body including a switching device; a base member forming a first concave portion and a cooling surface; and a wedge inserted in the first concave portion of the base member. The first concave portion of the base member is formed by a substrate portion forming the cooling surface, a first wall disposed on the opposite side of the substrate portion from the cooling surface, and an intermediate portion interconnecting the first wall and the substrate portion. The first wall forms an insertion space for insertion of the wedge, and a heat transfer plane forming a heat dissipating surface and a heat transfer path of the circuit body. The intermediate portion is plastically deformed by inserting the wedge into the insertion space, thus causing the first wall to be displaced toward the location of the circuit body.


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