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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9870971 B1

PDFFull Text
Date of Patent:
Jan. 16, 2018

Filed:

Jul. 01, 2016

Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same

Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Joo Young Chung, Suwon-si, KR;

Ki Hyeok Kwon, Suwon-si, KR;

Min Gyum Kim, Suwon-si, KR;

Jin Min Cheon, Suwon-si, KR;

Jin Woo Choi, Suwon-si, KR;

Seung Han, Suwon-si, KR;

Assignee:

SAMSUNG SDI CO., LTD., Yongin-Si, Gyeonggi-Do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
C08L 63/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); C08G 59/68 (2006.01); C08G 59/18 (2006.01); C08K 3/00 (2006.01); C08G 77/14 (2006.01); C08L 83/04 (2006.01); C08L 83/06 (2006.01); C08L 83/08 (2006.01); C08K 5/49 (2006.01); C08K 5/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); C08G 59/688 (2013.01); C08G 77/14 (2013.01); C08K 5/49 (2013.01); C08K 5/50 (2013.01); C08L 83/04 (2013.01); C08L 83/06 (2013.01); C08L 83/08 (2013.01); H01L 21/563 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract

An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:

Find Patent Forward Citations

Chung, Joo. (2018). Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same (U.S. Patent No. 9870971). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9870971

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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