The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Apr. 28, 2014
Applicant:

Kobelco Research Institute, Inc., Kobe-shi, JP;

Inventors:

Yuichi Taketomi, Takasago, JP;

Moriyoshi Kanamaru, Takasago, JP;

Shintaro Yoshida, Takasago, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01); H01J 37/34 (2006.01); C04B 35/01 (2006.01); C04B 35/447 (2006.01); C04B 35/645 (2006.01); C04B 37/02 (2006.01); C23C 14/34 (2006.01); C23C 14/08 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3417 (2013.01); C04B 35/01 (2013.01); C04B 35/447 (2013.01); C04B 35/645 (2013.01); C04B 37/026 (2013.01); C23C 14/082 (2013.01); C23C 14/085 (2013.01); C23C 14/3407 (2013.01); C23C 14/3414 (2013.01); H01J 37/3429 (2013.01); H01J 37/3435 (2013.01); H01J 37/3491 (2013.01); C04B 2235/3203 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/72 (2013.01); C04B 2235/721 (2013.01); C04B 2235/96 (2013.01); C04B 2235/963 (2013.01); C04B 2237/12 (2013.01); C04B 2237/34 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01);
Abstract

Provided is a target assembly which is manufactured by bonding a Li-containing oxide sputtering target and an Al-based or Cu-based backing plate through a bonding material. The Li-containing oxide target assembly does not undergo warping or cracking during the bonding. The Li-containing oxide target assembly according to the present invention is manufactured by bonding a Li-containing oxide sputtering target to a backing plate via a bonding material, and has bending strength of 20 MPa or larger.


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