The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Jan. 03, 2014
Applicant:
Cooper Technologies Company, Houston, TX (US);
Inventors:
Ahila Krishnamoorthy, Danville, CA (US);
Robert James Bogert, Lake Worth, FL (US);
Yipeng Yan, Shanghai, CN;
Assignee:
COOPER TECHNOLOGIES COMPANY, Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/02 (2006.01); H01F 27/06 (2006.01); H01F 17/06 (2006.01); H01F 27/29 (2006.01); H01F 5/00 (2006.01); H01F 17/04 (2006.01); H01F 27/28 (2006.01); H01F 3/10 (2006.01); H01F 3/14 (2006.01); H01F 27/255 (2006.01); H01F 27/30 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 3/10 (2013.01); H01F 3/14 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 27/2847 (2013.01); H01F 27/306 (2013.01); H01F 2003/106 (2013.01); H01F 2017/048 (2013.01);
Abstract
Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.