The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Mar. 10, 2015
Applicant:

The Hong Kong University of Science and Technology, Hong Kong, CN;

Inventors:

Xinfeng Zhang, Hong Kong, CN;

Matthew Ming-Fai Yuen, Hong Kong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C08J 3/21 (2006.01); C09D 5/24 (2006.01); C09D 5/26 (2006.01); C09K 5/14 (2006.01); C08K 9/00 (2006.01); C08J 3/205 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C08J 3/205 (2013.01); C08J 3/212 (2013.01); C08K 9/00 (2013.01); C09D 5/24 (2013.01); C09D 5/26 (2013.01); C09K 5/14 (2013.01); C08J 2333/12 (2013.01); C08J 2363/02 (2013.01); C08J 2383/04 (2013.01);
Abstract

An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.


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