The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Nov. 16, 2016
Applicant:

Formfactor, Inc., Livermore, CA (US);

Inventor:

Shawn Powell, Livermore, CA (US);

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 3/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07378 (2013.01); G01R 1/07342 (2013.01); G01R 3/00 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 1/0268 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.


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