The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Oct. 21, 2015
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Min Gyum Kim, Uiwang-si, KR;
Ki Hyeok Kwon, Uiwang-si, KR;
Dong Hwan Lee, Uiwang-si, KR;
Joo Young Chung, Uiwang-si, KR;
Jin Min Cheon, Uiwang-si, KR;
Jin Woo Choi, Uiwang-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 9/54 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08K 5/50 (2006.01); C07C 233/65 (2006.01); C07C 233/75 (2006.01); C07C 235/66 (2006.01); C07C 323/20 (2006.01); C07C 39/08 (2006.01); C07C 39/17 (2006.01); C07C 49/83 (2006.01); C08G 59/68 (2006.01); C09D 163/00 (2006.01); C08K 5/49 (2006.01); H01L 23/00 (2006.01); C07C 259/10 (2006.01); C07C 235/64 (2006.01); C07C 39/12 (2006.01); C08G 59/62 (2006.01);
U.S. Cl.
CPC ...
C07F 9/5442 (2013.01); C07C 39/08 (2013.01); C07C 39/12 (2013.01); C07C 39/17 (2013.01); C07C 233/65 (2013.01); C07C 235/64 (2013.01); C07C 235/66 (2013.01); C07C 259/10 (2013.01); C07C 323/20 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08K 5/49 (2013.01); C08K 5/50 (2013.01); C09D 163/00 (2013.01); H01L 23/295 (2013.01); H01L 24/29 (2013.01); C07C 2603/18 (2017.05); H01L 23/3121 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1: