The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Apr. 09, 2015
Samsung Display Co. Ltd., Yongin, Gyeonggi-Do, KR;
Dae Young Lee, Seoul, KR;
Hyun Bin Cho, Seongnam-si, KR;
Eun Jung Kim, Suwon-si, KR;
Gug Rae Jo, Asan-si, KR;
SAMSUNG DISPLAY CO. LTD., , KR;
Abstract
A method for manufacturing at least one stamp may include preparing a mold that includes mold protrusions, wherein the mold protrusions extend parallel to each other in a plan view of the mold and include a first mold protrusion. The method may further include providing resin on the mold, wherein the resin partially covers the mold protrusions without completely covering the mold protrusions, and wherein a side of the resin is at an angle with respect to the first mold protrusion in a plan view of a structure that includes the mold and the resin. The method may further include curing the resin to form cured resin. The method may further include forming a stamp that includes the cured resin.