The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Mar. 17, 2015
Beijing Lenovo Software Ltd., Beijing, CN;
Lenovo (Beijing) Limited, Beijing, CN;
Chunsun Zhang, Beijing, CN;
Zhigang Na, Beijing, CN;
Beijing Lenovo Software Ltd., Beijing, CN;
Lenovo (Beijing) Limited, Beijing, CN;
Abstract
The embodiment of the present disclosure provides a composite sheet, an electronic apparatus and a method for producing a component from the composite sheet, the composite sheet comprises a first sheet layer, a second sheet layer and a solid layer, wherein, the first sheet layer comprises at least one layer of first reinforced material; the second sheet layer comprises at least one layer of second reinforced material; the solid layer is located between the first sheet and the second sheet layer, wherein the solid layer is capable of being protruded from an interlayer space between the first sheet and the second sheet layer. Because the solid layer may be thermoplastic resin material which has a light weight, the entire weight of the composite sheet may be reduced. And during the over-molding process, the solid layer can effectively prevent the injection molding plastics from permeating into the composite sheet and thus prevent the deformation problem of the sheet layers on the surfaces of the composite sheet caused by the permeation, so that the composite sheet can maintain a better shape and the product quality is increased.