The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Oct. 30, 2013
Applicant:

Hitachi Aloka Medical, Ltd., Mitaka-shi, Tokyo, JP;

Inventors:

Kazuhiro Kobayashi, Mitaka, JP;

Toru Watanabe, Mitaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); A61B 8/12 (2006.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
A61B 8/546 (2013.01); A61B 8/12 (2013.01); A61B 8/445 (2013.01); A61B 8/4494 (2013.01); B06B 1/0629 (2013.01); B06B 2201/76 (2013.01);
Abstract

A body-cavity-insertion-type probe wherein an electronic circuit board is provided via a relay board on a back surface side of an oscillator unit. A backing member is joined to a center region of a back surface of the electronic circuit board. A wiring sheet is joined to a peripheral region of the back surface. A rear wing and a front wing of the wiring sheet surround a backing case, and a right wing and a left wing of an exhaust heat sheet protrude outward via two slits formed in a heat dissipation shell and are fixed on an outer surface of the heat dissipation shell. Heat generated by the electronic circuit board is transmitted to the heat dissipation shell via the exhaust heat sheet or the backing case, and heat is dissipated by the heat dissipation shell as a whole.


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