The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Jun. 29, 2015
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Dong Sun Kim, Seoul, KR;

Sung Wuk Ryu, Seoul, KR;

Hyun Seok Seo, Seoul, KR;

Ji Haeng Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H01L 23/49822 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81192 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 1/144 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/042 (2013.01); H05K 2203/1383 (2013.01);
Abstract

A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.


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