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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9867287 B1

PDFFull Text
Date of Patent:
Jan. 09, 2018

Filed:

Jul. 07, 2015

Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereof

Applicant:

Elite Electronic Material (Zhong Shan) Co., Ltd., Zhongshan, Guangdong Providence, CN;

Inventors:

Changyuan Li, Zhhongshan, CN;

Chen-Yu Hsieh, Guanyin Township, CN;

Hao Chen, Zhongshan, CN;

Lianhui Cai, Zhongshan, CN;

Xiangnan Li, Zhongshan, CN;

Assignee:

Elite Electronic Material (Zhong Shan) Co., Ltd., Zhongshan, CN;

Attorney:

Hoffmann & Baron, LLP

Primary Examiner:

William Cheung

Int. Cl.
CPC ...
B41M 5/00 (2006.01); B32B 15/08 (2006.01); C07F 9/48 (2006.01); C07F 9/53 (2006.01); H05K 1/03 (2006.01); C08K 5/5397 (2006.01); C08K 5/5313 (2006.01); C08K 5/54 (2006.01); B32B 5/00 (2006.01); B32B 15/00 (2006.01); B32B 27/00 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); C08L 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 5/00 (2013.01); B32B 15/00 (2013.01); B32B 27/00 (2013.01); C08K 5/5313 (2013.01); C08K 5/5397 (2013.01); C08K 5/5406 (2013.01); B32B 5/02 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2264/10 (2013.01); B32B 2274/00 (2013.01); B32B 2307/204 (2013.01); B32B 2307/30 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08L 1/00 (2013.01); H05K 1/024 (2013.01); H05K 1/0326 (2013.01); H05K 3/4688 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0195 (2013.01);
Abstract

The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a laminate having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and can effectively achieve the flame resistance effect of UL94 V-0 without using halogen-containing flame retardant, and can be used in the preparation of prepregs, resin films, resin coated coppers, flexible resin coated coppers, laminates and printed circuit boards.

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