The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Sep. 02, 2015
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Paul A. Martinez, Morgan Hill, CA (US);

Tyler S. Bushnell, Mountain View, CA (US);

Jason C. Sauers, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0295 (2013.01); H05K 3/301 (2013.01); H05K 3/3436 (2013.01); H05K 3/3442 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09954 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10962 (2013.01); H05K 2201/2036 (2013.01);
Abstract

An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.


Find Patent Forward Citations

Loading…