The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Jun. 29, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 21/4846 (2013.01); H01L 23/49838 (2013.01); H05K 1/03 (2013.01); H05K 3/0011 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0293 (2013.01);
Abstract
A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.