The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Jul. 07, 2015
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Kazuaki Kojima, Suwa, JP;

Assignee:

Olympus Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/04 (2006.01); H04N 5/225 (2006.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); G02B 23/24 (2006.01); H04N 5/369 (2011.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); A61B 1/0011 (2013.01); A61B 1/00124 (2013.01); A61B 1/051 (2013.01); G02B 23/2484 (2013.01); H04N 5/2253 (2013.01); H04N 5/369 (2013.01); H05K 1/021 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/3431 (2013.01); H05K 5/04 (2013.01); H05K 2201/055 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1305 (2013.01); H05K 2203/302 (2013.01);
Abstract

A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.


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