The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Oct. 25, 2013
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Tetsuo Saji, Tokyo, JP;
Hiroshi Nakamura, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/44 (2006.01); H04B 1/48 (2006.01); H04B 1/04 (2006.01); H04B 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H04B 1/48 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H04B 1/0458 (2013.01); H04B 1/18 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.