The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

May. 26, 2015
Applicants:

Vahid Miraftab, Kanata, CA;

Wenyao Zhai, Kanata, CA;

Morris Repeta, Ottawa, CA;

Inventors:

Vahid Miraftab, Kanata, CA;

Wenyao Zhai, Kanata, CA;

Morris Repeta, Ottawa, CA;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 1/24 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/005 (2013.01); H01Q 1/243 (2013.01); H01Q 1/246 (2013.01); H01Q 21/065 (2013.01);
Abstract

A Printed Circuit Board (PCB) comprising various integral components and method of manufacture are provided. The PCB includes a Substrate Integrated Waveguide (SIW), integrated waveguide antennas disposed above the SIW, apertures formed in SIW for coupling with the waveguide antennas, a transmission line routed above the SIW and using the SIW as a ground plane thereof, and further antennas, integrated into the PCB and disposed above and coupled to the transmission line. The SIW and the transmission line may be branched structures for feeding corresponding arrays of waveguide antennas and further antennas. Coplanar waveguides may also be integrated into the PCB and coupled to the SIW and the transmission line via integral impedance matching structures. PCB feature re-use and component interleaving may provide for a desirable and manufacturable PCB structure.


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