The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Aug. 13, 2015
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Xiaoxiao Wang, Guangdong, CN;

Peng Du, Guangdong, CN;

Cong Wang, Guangdong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 21/22 (2006.01); H01L 21/265 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1222 (2013.01); H01L 21/02164 (2013.01); H01L 21/02238 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/32133 (2013.01); H01L 27/124 (2013.01); H01L 27/127 (2013.01); H01L 27/1218 (2013.01); H01L 27/1288 (2013.01); H01L 29/458 (2013.01); H01L 29/66757 (2013.01); H01L 29/78633 (2013.01); H01L 29/78675 (2013.01); G02F 1/1368 (2013.01); G02F 2202/104 (2013.01); H01L 21/22 (2013.01); H01L 21/26513 (2013.01);
Abstract

An array substrate and a manufacturing method thereof are provided. The method has steps of: forming a buffer layer, a light-shading layer, and a whole semiconductor layer on a substrate; simultaneously patterning the semiconductor layer and the light-shading layer; and forming a first insulation layer, a first metal layer, a second insulation layer, a second metal layer, a flat layer, and a first transparent conductive layer on the patterned semiconductor layer.


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