The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Feb. 10, 2016
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Hideaki Katakura, Matsumoto, JP;

Yoshiaki Toyoda, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); G01R 31/26 (2014.01); H01L 29/735 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); G01R 31/2601 (2013.01); H01L 29/735 (2013.01);
Abstract

A semiconductor device and a method for testing the semiconductor device are provided. The semiconductor device includes a diode (protection element) and a semiconductor element having a withstand voltage that is higher than that of the diode provided on one and the same first-conductive-type semiconductor substrate, the diode having a second-conductive-type first semiconductor region selectively provided in a front surface layer of the semiconductor substrate. A high concentration region is open in a normal time, but is short-circuited to a potential higher than that of a GND pad through a second wiring layer in a screening test time. Thus, a semiconductor device and a method for testing the semiconductor device are provided, in which a protection element can be prevented from breaking down and initial failure of a device which is formed on one and the same semiconductor substrate as the protection element can be detected accurately.


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