The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Jan. 22, 2016
Applicant:

Texas Instruments Deutschland Gmbh, Freising, DE;

Inventor:

Christoph Dirnecker, Eching, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/01 (2006.01); H01L 49/02 (2006.01); H01L 21/70 (2006.01); H01L 23/522 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 27/016 (2013.01); H01L 21/31116 (2013.01); H01L 21/32135 (2013.01); H01L 21/707 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 23/5228 (2013.01); H01L 28/20 (2013.01); H01L 28/60 (2013.01); H01L 21/31144 (2013.01); H01L 21/32139 (2013.01); H01L 23/53266 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electronic device comprising a semiconductor structure having a back end capacitor and a back end thin film resistor and a method of manufacturing the same. The semiconductor structure includes a first dielectric layer, a bottom plate of the capacitor and a thin film resistor body. The bottom plate and the resistor body are laterally spaced apart portions of the same thin film layer. The bottom plate further includes a conductive layer overlying the thin film layer. A second dielectric layer is disposed on the conductive layer of the bottom plate of the capacitor. A top plate of the capacitor is disposed on the second dielectric layer.


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