The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Feb. 05, 2017
Applicant:

Adl Engineering Inc., Hsin-Chu, TW;

Inventors:

En-Min Jow, Hsin-Chu, TW;

Cheng-Yu Kang, Hsin-Chu, TW;

Assignee:

ADL ENGINEERING INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/73 (2013.01); H01L 21/4853 (2013.01); H01L 23/145 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/97 (2013.01); H05K 1/111 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01);
Abstract

A package carrier is provided. The package carrier includes a wiring layer and an insulating pattern. The wiring layer includes at least one connecting pad and at least one mounting pad. The mounting pad is used for mounting an electronic component, and the connecting pad is used for electrically connecting the electronic component. The insulating pattern is stacked on and connected to the wiring layer. A boundary surface is formed between the wiring layer and the insulating pattern. Both of the wiring layer and the insulating pattern do not extend over the boundary surface. In addition, an electronic package including the package carrier is also provided.


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