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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9865468 B1

PDFFull Text
Date of Patent:
Jan. 09, 2018

Filed:

Oct. 06, 2015

Method of positioning cutting member to semiconductor chip with grooves

Applicant:

Fuji Xerox Co., Ltd., Tokyo, JP;

Inventors:

Kenichi Ono, Ebina, JP;

Michiaki Murata, Ebina, JP;

Tsutomu Otsuka, Ebina, JP;

Assignee:

FUJI XEROX CO., LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/06 (2006.01); H01L 21/304 (2006.01); H01L 21/268 (2006.01); H01L 21/3065 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3043 (2013.01); H01L 21/268 (2013.01); H01L 21/3065 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided is a method for manufacturing a semiconductor chip including forming a groove on a front surface side along a cut area of a substrate, and a concave portion deeper than the groove on the front surface side as a positioning mark for a cutting member that performs cutting from a back surface of the substrate along the groove on the front surface side, thinning the substrate so as to reach the concave portion and not reach the groove on the front surface side, in the back surface of the substrate, positioning the cutting member from the back surface of the substrate by using the concave portion exposed on the back surface of the substrate as the positioning mark, and performing cutting from the back surface side of the substrate toward the groove on the front surface side of the substrate by using the positioned cutting member.

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Quick Actions:

Ono, Kenichi. (2018). Method of positioning cutting member to semiconductor chip with grooves (U.S. Patent No. 9865468). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9865468

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