The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
May. 31, 2016
Applicant:
Nhk Spring Co., Ltd., Yokohama-shi, Kanagawa, JP;
Inventor:
Naoki Tanaka, Kanagawa, JP;
Assignee:
NHK Spring Co., Ltd., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); B23K 26/22 (2006.01); B23K 26/32 (2014.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4826 (2013.01); B23K 26/22 (2013.01); B23K 26/32 (2013.01); B23K 2201/36 (2013.01);
Abstract
Provided is a wiring thin plate capable of securely hold-down the wiring thin plate around a scheduled portion to be a welded spot even if the wiring thin plate is downsized and involves widened wiring traces. The wiring thin plate includes a metal supporting layer, an insulating layer on the supporting layer, a wiring part having a plurality of wiring traces on the insulating layer, a scheduled portion defined on the supporting layer to be welded, and a protrusion formed on the supporting layer for the scheduled portion and having a height that is the same as a height of the wiring part.