The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Sep. 16, 2014
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventor:
Yuya Dokai, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); G06K 19/07 (2006.01); H01Q 9/06 (2006.01); H01Q 7/00 (2006.01); G06K 19/077 (2006.01); H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0726 (2013.01); G06K 19/07722 (2013.01); G06K 19/07754 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 7/00 (2013.01); H01Q 9/06 (2013.01); H04B 5/0062 (2013.01); H04B 5/0075 (2013.01);
Abstract
A wireless communication device includes a wireless IC device, a multilayer substrate including a stack of a plurality of dielectric layers, a resonant circuit that is connected to the wireless IC device and that includes a capacitance element provided in the multilayer substrate and an inductance element provided outside the multilayer substrate, and a radiation conductor connected to the resonant circuit.