The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Sep. 08, 2014
Applicant:

Sharp Kabushiki Kaisha, Osaka, JP;

Inventor:

Yasumori Fukushima, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1368 (2006.01); H01L 51/10 (2006.01); H01L 27/28 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1368 (2013.01); H01L 51/105 (2013.01); H01L 27/283 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01); H01L 2251/301 (2013.01);
Abstract

An aim of the present invention is to reduce manufacturing costs and lower the electrical resistance of composite metal electrodes while lowering the contact resistance of the composite metal electrodes with respect to an organic semiconductor film. A TFT (semiconductor device) of the present invention includes an organic semiconductor film formed from an organic semiconductor material, and a source electrode and a drain electrode that are composite metal electrodes that contact the organic semiconductor film. The source electrode and the drain electrode are configured such that a low-resistance metal material that makes ohmic contact with the organic semiconductor film, the contact resistance thereof being lower than that of a base metal material formed of a metal material, is mixed with the base metal material, and the low-resistance metal material is disposed so as to be exposed at least at a contact surface with the organic semiconductor film.


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