The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Oct. 24, 2013
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Kogo Endo, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01); G01N 29/24 (2006.01); B06B 1/06 (2006.01); A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
G01N 29/2437 (2013.01); A61B 8/4483 (2013.01); A61B 8/4494 (2013.01); B06B 1/0622 (2013.01); A61B 8/4411 (2013.01); A61B 8/4488 (2013.01); G01N 2291/106 (2013.01);
Abstract

An ultrasonic measurement device includes a substrate, an ultrasonic element array, an ultrasonic transducer device, and an integrated circuit device. The ultrasonic element array has a plurality of ultrasonic elements arranged on the substrate. The ultrasonic transducer device is formed on the substrate and having a plurality of signal electrode lines electrically connected to the ultrasonic element array. The integrated circuit device has a plurality of terminals to output a transmission signal to the ultrasonic element array. Each of the signal electrode lines includes an electrode layer in which at least one signal electrode among some of the ultrasonic elements is formed to extend on the substrate. The integrated circuit device is mounted on the substrate, and each of the terminals of the integrated circuit device is connected to a corresponding one of the signal electrode lines.


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