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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9863584 B1

PDFFull Text
Date of Patent:
Jan. 09, 2018

Filed:

Nov. 19, 2015

Led lighting apparatus

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Tomoharu Horio, Kyoto, JP;

Teruki Ono, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Bao Q Truong

Int. Cl.
CPC ...
F21K 99/00 (2016.01); H01L 25/075 (2006.01); H05K 3/28 (2006.01); F21V 15/00 (2015.01); F21K 9/232 (2016.01); F21S 8/02 (2006.01); F21V 3/02 (2006.01); F21V 23/00 (2015.01); H01L 33/64 (2010.01); H05K 1/03 (2006.01); F21V 29/74 (2015.01); F21V 29/89 (2015.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01); F21K 9/238 (2016.01);
U.S. Cl.
CPC ...
F21K 9/135 (2013.01); F21K 9/232 (2016.08); F21V 15/00 (2013.01); F21V 23/002 (2013.01); H01L 25/0753 (2013.01); H05K 3/282 (2013.01); F21K 9/238 (2016.08); F21S 8/026 (2013.01); F21V 3/02 (2013.01); F21V 23/006 (2013.01); F21V 29/74 (2015.01); F21V 29/89 (2015.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/644 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/4945 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/2054 (2013.01);
Abstract

An LED lighting apparatus is disclosed. The LED lighting apparatus includes a board having a principal surface, a plurality of LED chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of LED chips. Further, the LED lighting apparatus includes a frame-like bank which is provided on the principal surface of the board and surrounds the plurality of LED chips. In this case, the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips. The LED lighting apparatus further includes a protective layer covering at least a portion of the pads.

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