The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9863034 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 09, 2018

Filed:

Apr. 17, 2015
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventor:

Yuji Yanagi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/24 (2006.01); C23C 14/12 (2006.01); C23C 14/54 (2006.01);
U.S. Cl.
CPC ...
C23C 14/24 (2013.01); C23C 14/12 (2013.01); C23C 14/243 (2013.01); C23C 14/543 (2013.01);
Abstract

In a vacuum vapor deposition method which is carried out at a vacuum vapor deposition apparatus including a plurality of linear-shaped vaporization sources, an equal-thickness surface is calculated with respect to each of a polarity of release holes. The equal-thickness surface indicates a surface where a deposition amount of vapor of a vaporization material released from the corresponding release hole is the same per unit time. Then, the vaporization containers are placed in such a manner that contact points of the equal-thickness surfaces all coincide with each other on a deposition surface of a substrate, each of the contact points being where the corresponding equal-thickness surface comes in contact with the surface of the substrate.


Find Patent Forward Citations

Yanagi, Yuji. (2018). Vacuum vapor deposition method (U.S. Patent No. 9863034). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9863034

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