The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Dec. 02, 2013
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, KR;
Inventors:
Nam Hyun Kim, Uiwang-si, KR;
Chan Gyun Shin, Uiwang-si, KR;
Byung Kuk Jeon, Uiwang-si, KR;
Jong Cheol Lim, Uiwang-si, KR;
Assignee:
Lotte Advanced Materials Co., Ltd., Yeosu-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08L 69/00 (2006.01); C08L 23/26 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08L 23/26 (2013.01); C08L 69/00 (2013.01); C08K 2201/001 (2013.01);
Abstract
The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.