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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9862825 B1

PDFFull Text
Date of Patent:
Jan. 09, 2018

Filed:

Mar. 29, 2012

Thermoplastic resin composition having high durability

Applicants:

Toshiaki Kasazaki, Yamatokohriyama, JP;

Takahiko Yoshida, Yamatokohriyama, JP;

Shoji Shimizu, Yamatokohriyama, JP;

Shinsuke Uegaki, Yamatokohriyama, JP;

Yoko Onishi, Yamatokohriyama, JP;

Inventors:

Toshiaki Kasazaki, Yamatokohriyama, JP;

Takahiko Yoshida, Yamatokohriyama, JP;

Shoji Shimizu, Yamatokohriyama, JP;

Shinsuke Uegaki, Yamatokohriyama, JP;

Yoko Onishi, Yamatokohriyama, JP;

Assignee:

NITTA CORPORATION, Osaka-Shi, Osaka, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Mike M Dollinger

Int. Cl.
CPC ...
C08L 75/06 (2006.01); C08L 23/08 (2006.01); C08L 75/04 (2006.01); C08L 23/26 (2006.01); C08L 75/12 (2006.01); B65G 15/32 (2006.01); F16G 1/14 (2006.01); C08L 67/02 (2006.01); C08L 77/06 (2006.01); C08L 77/12 (2006.01); C08L 23/16 (2006.01); C08G 69/40 (2006.01); C08G 69/44 (2006.01); C08L 77/02 (2006.01); C08L 53/02 (2006.01);
U.S. Cl.
CPC ...
C08L 75/06 (2013.01); B65G 15/32 (2013.01); C08L 23/0869 (2013.01); C08L 23/26 (2013.01); C08L 67/02 (2013.01); C08L 67/025 (2013.01); C08L 75/04 (2013.01); C08L 75/12 (2013.01); C08L 77/06 (2013.01); C08L 77/12 (2013.01); F16G 1/14 (2013.01); C08G 69/40 (2013.01); C08G 69/44 (2013.01); C08L 23/16 (2013.01); C08L 53/025 (2013.01); C08L 77/02 (2013.01); C08L 2207/04 (2013.01); Y10T 428/1372 (2015.01);
Abstract

The thermoplastic resin composition according to the present invention includes a thermoplastic resin (A), and a modified ethylene copolymer (B) dispersed and contained therein, wherein the modified ethylene copolymer (B) in the thermoplastic resin composition has an average dispersed particle aspect ratio of 1 to 3.5, and an average dispersed particle diameter of not more than 3 μm. The modified ethylene copolymer (B) is preferably a copolymer, modified with an unsaturated carboxylic acid or a derivative thereof, of ethylene with at least one monomer component selected from the group consisting of (i) olefin components except for ethylene, (ii) diene components and (iii) ester components having an ethylenically unsaturated group.

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