The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Jul. 16, 2015
Applicant:
Merck Sharp & Dohme Corp., Rahway, NJ (US);
Inventors:
John Y. L. Chung, Edison, NJ (US);
Feng Peng, Edison, NJ (US);
Yonggang Chen, Westfield, NJ (US);
Amude Mahmoud Kassim, Fairless Hills, PA (US);
Cheng-yi Chen, Princeton, NJ (US);
Mathew Maust, Manville, NJ (US);
Mark McLaughlin, Summit, NJ (US);
Michael J. Zacuto, Jersey City, NJ (US);
Qinghao Chen, Edison, NJ (US);
Lushi Tan, Edison, NJ (US);
Zhiguo Jake Song, Edison, NJ (US);
Yang Cao, Scotch Plains, NJ (US);
Feng Xu, Staten Island, NY (US);
Assignee:
Merck Sharp & Dohme Corp., Rahway, NJ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C07D 231/56 (2006.01); C07D 405/04 (2006.01); C07C 69/73 (2006.01); C07F 5/04 (2006.01); C07D 487/04 (2006.01); A61K 31/4162 (2006.01);
U.S. Cl.
CPC ...
C07D 487/04 (2013.01); A61K 31/4162 (2013.01);
Abstract
A process for preparing a compound of structural Formula Ia: comprising Boc deprotection with TFA of, reductive amination of: