The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Dec. 14, 2015
Ndsu Research Foundation, Fargo, ND (US);
Val R. Marinov, Fargo, ND (US);
Orven Swenson, Fargo, ND (US);
Mark Pavicic, Fargo, ND (US);
Ross A. Miller, Moorhead, MN (US);
Zhigang Chen, Fargo, ND (US);
Ferdous Sarwar, Fargo, ND (US);
Matthew R. Semler, Appleton, MN (US);
NDSU RESEARCH FOUNDATION, Fargo, ND (US);
Abstract
Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.