The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Sep. 21, 2010
Applicants:

Chung-chih Feng, Kaohsiung, TW;

I-peng Yao, Kaohsiung, TW;

Yung-chang Hung, Kaohsiung, TW;

Lyang-gung Wang, Kaohsiung, TW;

Inventors:

Chung-Chih Feng, Kaohsiung, TW;

I-Peng Yao, Kaohsiung, TW;

Yung-Chang Hung, Kaohsiung, TW;

Lyang-Gung Wang, Kaohsiung, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 3/14 (2006.01); B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01);
Abstract

The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.


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