The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
May. 04, 2016
Applicant:
Stora Enso Oyj, Helsinki, FI;
Inventors:
Petri Sirviö, Imatra, FI;
Juha Maijala, Espoo, FI;
Assignee:
STORA ENSO OYJ, Helsinki, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); B05B 5/14 (2006.01); B05C 1/00 (2006.01); B05D 3/12 (2006.01); B05C 19/00 (2006.01); B05D 1/00 (2006.01); B05D 1/28 (2006.01); B05D 3/02 (2006.01); B05D 3/06 (2006.01); C23C 26/02 (2006.01); H05K 1/03 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
B05C 1/003 (2013.01); B05C 19/008 (2013.01); B05D 1/007 (2013.01); B05D 1/28 (2013.01); B05D 3/029 (2013.01); B05D 3/0263 (2013.01); B05D 3/06 (2013.01); B05D 3/12 (2013.01); C23C 26/02 (2013.01); H05K 3/102 (2013.01); H05K 3/1283 (2013.01); H05K 1/038 (2013.01); H05K 1/0386 (2013.01); H05K 3/1241 (2013.01); H05K 3/1266 (2013.01); H05K 2201/0293 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0517 (2013.01); H05K 2203/0522 (2013.01); H05K 2203/102 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1476 (2013.01); H05K 2203/1545 (2013.01); H05K 2203/1581 (2013.01);
Abstract
A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.