The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Feb. 15, 2008
Robert J. Greenberg, Los Angeles, CA (US);
Eugene DE Juan, San Francisco, CA (US);
Mark S. Humayun, Glendale, CA (US);
Kelly H. Mcclure, Simi Valley, CA (US);
Neil Hamilton Talbot, La Crescenta, CA (US);
Jordan Matthew Neysmith, Pasadena, CA (US);
Brian V. Mech, Stevenson Ranch, CA (US);
James Singleton Little, Saugus, CA (US);
Mohamed Khaldi, Los Angeles, CA (US);
Robert J. Greenberg, Los Angeles, CA (US);
Eugene de Juan, San Francisco, CA (US);
Mark S. Humayun, Glendale, CA (US);
Kelly H. McClure, Simi Valley, CA (US);
Neil Hamilton Talbot, La Crescenta, CA (US);
Jordan Matthew Neysmith, Pasadena, CA (US);
Brian V. Mech, Stevenson Ranch, CA (US);
James Singleton Little, Saugus, CA (US);
Mohamed Khaldi, Los Angeles, CA (US);
Second Sight Medical Products, Inc., Sylmar, CA (US);
Abstract
The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.