The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Jul. 20, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
John U. Knickerbocker, Monroe, NY (US);
Shriya Kumar, New York, NY (US);
Jae-Woong Nah, Closter, NJ (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/113 (2006.01); A61B 5/00 (2006.01); B23K 3/06 (2006.01); A61M 5/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
A61B 5/68 (2013.01); A61M 5/00 (2013.01); B23K 3/0638 (2013.01); A61B 2562/12 (2013.01); A61M 2207/00 (2013.01); B23K 2201/36 (2013.01);
Abstract
A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.