The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Apr. 17, 2015
Applicant:

Deere & Company, Moline, IL (US);

Inventors:

Brij N. Singh, West Fargo, ND (US);

Thomas Roan, Fargo, ND (US);

Andrew D. Wieland, Fargo, ND (US);

Neal D. Clements, Sheldon, ND (US);

Assignee:

DEERE & COMPANY, Moline, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/473 (2013.01); H05K 1/111 (2013.01); H01L 2023/4043 (2013.01); H01L 2023/4056 (2013.01);
Abstract

An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.


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