The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Aug. 02, 2017
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Cheng-Jia Li, Qinhuangdao, CN;

Ming-Hua Du, Qinhuangdao, CN;

Gang Yuan, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0274 (2013.01); H05K 1/0346 (2013.01); H05K 1/095 (2013.01); H05K 1/115 (2013.01); H05K 3/0017 (2013.01); H05K 3/027 (2013.01); H05K 3/06 (2013.01); H05K 3/28 (2013.01); H05K 3/4069 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0329 (2013.01); H05K 2201/09036 (2013.01); H05K 2203/121 (2013.01);
Abstract

A transparent flexible printed circuit board (FPCB) of reduced thickness but good conductivity and transparency includes an insulating resin layer. The insulating resin layer has a first surface and a second surface. At least one through hole is defined in the insulating resin layer through the first surface and the second surface. A conductive wiring layer is formed on the first surface and a wiring layer is formed on the second surface. The conductive wiring layers are made of electrically conductive resin, and have wiring openings. A cover film covers each of the conductive wiring layers, and further infills the wiring openings.


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