The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Jan. 30, 2014
Applicant:
Hewlett Packard Enterprise Development Lp, Houston, TX (US);
Inventors:
Mark Vinod Kapoor, Houston, TX (US);
David W. Engler, Cypress, TX (US);
Assignee:
Hewlett Packard Enterprise Development LP, Houston, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0209 (2013.01); H05K 1/0228 (2013.01); H05K 1/0243 (2013.01); H05K 1/116 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10189 (2013.01);
Abstract
A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.