The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Apr. 29, 2016
Applicant:
Commscope Technologies Llc, Hickory, NC (US);
Inventor:
Jeffery D. Paynter, Momence, IL (US);
Assignee:
CommScope Technologies LLC, Hickory, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01R 43/02 (2006.01); H01R 9/05 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 101/38 (2006.01); B23K 101/32 (2006.01);
U.S. Cl.
CPC ...
H01R 4/024 (2013.01); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); H01R 9/05 (2013.01); H01R 43/0207 (2013.01); B23K 2201/32 (2013.01); B23K 2201/38 (2013.01);
Abstract
A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector; lowering the connector body onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.