The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Dec. 28, 2015
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Benjamin Krummacher, Regensburg, DE;

Joerg Farrnbacher, Regensburg, DE;

Simon Schicktanz, Regensburg, DE;

Kilian Regau, Regensburg, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 51/52 (2006.01); H01L 51/44 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 51/441 (2013.01); H01L 51/448 (2013.01); H01L 51/5203 (2013.01); H01L 51/524 (2013.01); H01L 51/5206 (2013.01); H01L 51/5221 (2013.01); H01L 51/56 (2013.01); H01L 2251/5361 (2013.01); H01L 2251/558 (2013.01);
Abstract

Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.


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