The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Sep. 29, 2016
Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Byung Wook Kim, Seongnam-si, KR;

Kyong Hwa Song, Seoul, KR;

Jin Woo Kwak, Gyeongsan-si, KR;

Gyung Bok Kim, Yongin-si, KR;

In Woong Lyo, Suwon-si, KR;

Han Saem Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/10 (2006.01); H01L 35/32 (2006.01); H01L 35/34 (2006.01); H01L 35/04 (2006.01);
U.S. Cl.
CPC ...
H01L 35/34 (2013.01); H01L 35/04 (2013.01); H01L 35/32 (2013.01);
Abstract

A method for packaging a thermoelectric module may include thermoelectric module accommodation, of accommodating at least one thermoelectric module in a housing having a base and a sidewall, electric wire sealing, of sealing an electric wire of the thermoelectric module with a sealing tube, bonding member interposing, of placing a cover having a top portion and a sidewall on top of the housing and interposing a bonding member between the sidewall of the housing and the sidewall of the cover, and bonding, of bonding the sidewall of the housing and the sidewall of the cover that are hermetically sealed by the bonding member, in which the bonding member may be formed of a resin material.


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