The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Aug. 12, 2016
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Takayuki Kusunoki, Annaka, JP;

Hiroyuki Iguchi, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/08 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); C08L 83/16 (2006.01); C08G 77/60 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); C08L 83/16 (2013.01); H01L 33/56 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/60 (2013.01); C08G 2190/00 (2013.01);
Abstract

An addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) a silphenylene oligomer having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst cures into a product having both a satisfactory hardness and crack resistance.


Find Patent Forward Citations

Kusunoki, Takayuki. (2018). Addition curable organopolysiloxane composition, and semiconductor package (U.S. Patent No. 9859474). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9859474

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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