The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Apr. 14, 2014
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Shunpei Yamazaki, Setagaya, JP;

Kazuo Nishi, Fujisawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/028 (2006.01); H01L 31/077 (2012.01); H01L 31/046 (2014.01); H01L 31/0463 (2014.01); H01L 31/0465 (2014.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/182 (2013.01); H01L 31/028 (2013.01); H01L 31/046 (2014.12); H01L 31/0463 (2014.12); H01L 31/0465 (2014.12); H01L 31/077 (2013.01); H01L 31/186 (2013.01); H01L 31/1872 (2013.01); H01L 21/0245 (2013.01); H01L 21/02532 (2013.01); H01L 21/02672 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

In a thin film photoelectric conversion device fabricated by addition of a catalyst element with the use of a solid phase growth method, defects such as a short circuit or leakage of current are suppressed. A catalyst material which promotes crystallization of silicon is selectively added to a second silicon semiconductor layer formed over a first silicon semiconductor layer having one conductivity type, the second silicon semiconductor layer is partly crystallized by a heat treatment, a third silicon semiconductor layer having a conductivity type opposite to the one conductivity type is stacked, and element isolation is performed at a region in the second silicon semiconductor layer to which a catalyst material is not added, so that a left catalyst material is prevented from being diffused again, and defects such as a short circuit or leakage of current are suppressed.


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