The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Aug. 30, 2016
Applicant:
Stmicroelectronics (Shenzhen) R&d Co. Ltd., Shenzhen, CN;
Inventor:
Jing-En Luan, Shenzhen, CN;
Assignee:
STMICROELECTRONICS (SHENZHEN) R&D CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/433 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/482 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49531 (2013.01); H01L 21/56 (2013.01); H01L 21/76885 (2013.01); H01L 23/3114 (2013.01); H01L 23/3675 (2013.01); H01L 23/4334 (2013.01); H01L 23/481 (2013.01); H01L 23/482 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49555 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49805 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/09 (2013.01); H01L 24/33 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 21/561 (2013.01); H01L 23/28 (2013.01); H01L 23/3107 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/03003 (2013.01); H01L 2224/03334 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/06136 (2013.01); H01L 2224/06177 (2013.01); H01L 2224/09151 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/85 (2013.01); H01L 2224/92127 (2013.01); H01L 2224/92242 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.